Worcester Polytechnic Institute Electronic Theses and Dissertations Collection

Title page for ETD etd-0108102-140953


Document Typethesis
Author NameBowman, Amy Catherine
Email Address bowmanac at corning.com
URNetd-0108102-140953
TitleA Selective Encapsulation Solution For Packaging An Optical Micro Electro Mechanical System
DegreeMS
DepartmentMaterials Science & Engineering
Advisors
  • Richard D. Sisson, Jr., Advisor
  • Isa Bar-On, Co-Advisor
  • Kathryn Zeisler-Mashl, Co-Advisor
  • Keywords
  • micro electro mechanical systems
  • packaging
  • die warpage
  • electronics
  • MEMS
  • die bow
  • encapsulant
  • encapsulate
  • electrochemical migration
  • corrosion
  • wirebonds
  • Date of Presentation/Defense2002-01-03
    Availability unrestricted

    Abstract

    This work developed a process to provide physical, electrical, and environmental protection to the electrical lead system of an optical switch device. A literature review was conducted to find materials and processes suitable to the stress-sensitive, high voltage characteristics of many optical switch devices. An automatic dispensing dam and fill process, and three candidate materials (two epoxy and one silicone) were selected for investigation. Experimental and analytical techniques were used to evaluate the materials. Methods applied included interferometric die warpage measurements, electrochemical migration resistance tests (ECMT), thermal cycling, and finite element analysis.

    The silicone dam and fill system was selected based upon the results of die warpage and electrochemical migration resistance tests. A modified, selective dam and fill process was developed and preliminary reliability testing was performed. The paper provides detailed instructions for successful encapsulation of the optical switch’s lead system.

    Files
  • bowman.pdf

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