Title page for ETD etd-0108102-140953

Document Type	thesis
Author Name	Bowman, Amy Catherine
Email Address	bowmanac at corning.com
URN	etd-0108102-140953
Title	A Selective Encapsulation Solution For Packaging An Optical Micro Electro Mechanical System
Degree	MS
Department	Materials Science & Engineering
Advisors	Richard D. Sisson, Jr., Advisor Isa Bar-On, Co-Advisor Kathryn Zeisler-Mashl, Co-Advisor
Keywords	micro electro mechanical systems packaging die warpage electronics MEMS die bow encapsulant encapsulate electrochemical migration corrosion wirebonds
Date of Presentation/Defense	2002-01-03
Availability	unrestricted
Abstract This work developed a process to provide physical, electrical, and environmental protection to the electrical lead system of an optical switch device. A literature review was conducted to find materials and processes suitable to the stress-sensitive, high voltage characteristics of many optical switch devices. An automatic dispensing dam and fill process, and three candidate materials (two epoxy and one silicone) were selected for investigation. Experimental and analytical techniques were used to evaluate the materials. Methods applied included interferometric die warpage measurements, electrochemical migration resistance tests (ECMT), thermal cycling, and finite element analysis. The silicone dam and fill system was selected based upon the results of die warpage and electrochemical migration resistance tests. A modified, selective dam and fill process was developed and preliminary reliability testing was performed. The paper provides detailed instructions for successful encapsulation of the optical switch’s lead system.
Files	bowman.pdf

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